TY  - BOOK
AU  - 
AU  - 
ED  - SpringerLink (Online service)
TI  - Coupled Data Communication Techniques for High-Performance and Low-Power Computing
T2  - Integrated Circuits and Systems,
SN  - 9781441965882
AV  - TK7888.4 
U1  - 621.3815 23
PY  - 2010///
CY  - Boston, MA
PB  - Springer US
KW  - Engineering
KW  - Computer hardware
KW  - Computer engineering
KW  - Electronics
KW  - Systems engineering
KW  - Circuits and Systems
KW  - Electronics and Microelectronics, Instrumentation
KW  - Electrical Engineering
KW  - Computer Hardware
N1  - to Coupled Data Technologies -- Overview of 3D Technologies -- Power delivery, signaling and cooling for 2D and 3D integrated systems -- Coupled Data Technologies -- Capacitive Coupled Communication -- Inductive Coupled Communications -- Use of AC Coupled Interconnect in Contactless Packaging -- Enabling Coupled Data Technologies -- Aligning chips face-to-face for dense capacitive communication -- Extending Data Coupling Technologies -- Delivering On-chip Bandwidth Off-chip and Out-of-box with Proximity and Optical Communication -- AC Coupled Wireless Power Delivery; ZDB-2-ENG
N2  - Designers of next-generation high-performance computer systems face a host of technical challenges. For the past several decades, rising clock frequencies and increased chip integration have fueled the growth of computer performance. Now these trends have slowed: power and complexity constrains further increases in clock frequencies, and economic realities limit the pace of Moore's Law. Coupled data communication provides a way forward, and this book, Coupled Data Communication Techniques for High-Performance and Low-Power Computing, gives a comprehensive overview for such coupled data techniques. Coupled data communication allows chips to communicatecapacitively or inductivelyover short distances between chips without solder, and fundamentally shifts the design paradigm from single-chip integration to single-package integration. This book covers the state-of-the-art in the circuits, architectures, and chip packaging for this novel chip-to-chip communication technology and showcases its potential to drive the coming decades of industry growth. Coupled Data Communication Techniques for High-Performance and Low-Power Computing should be of interest to students and designers in circuits and system architecture
UR  - http://dx.doi.org/10.1007/978-1-4419-6588-2
ER  -